Mason Optistack Lab
High-Density AI Interconnects & Advanced Optical Packaging Substrates
B2B Prototyping and Production Infrastructure Partner
Mason Optistack Lab
eliminate standard factory lead times by providing high-performance, validated network interconnect components directly from China's premier optical clusters (Suzhou & Wuhan). Engineered for rapid validation loops and stable deployment in cutting-edge 800G and 1.6T environments.
Active Cables & Transceivers (AEC / LPO)
Automated EEPROM firmware optimization across CMIS 5.0 registers (Page 00h/10h) . Engineered to eliminate vendor-lock port rejection errors and compatibility blocks across Nvidia, Arista, and Cisco ASIC ecosystems. Pre-configured for immediate validation in high-frequency 800G form factors.
Micro-Optics & Fiber Arrays (FAU)
Fused Silic (Pure Quartz) V-Groove arrays optimized for surface grating and vertical coupling layouts. Strict 127μm or 250μm pitch spacing with a cumulative error threshold ≤ ±0.5μm. Precision-ground 8° APC end-face finish with core concentricity ≤ 0.5μm and atomic roughness Ra ≤ 5nm.
Advanced Packaging Substrates (TGV)
Laser-drilled Through-Glass Via (TGV) semiconductor-grade glass carriers for next-generation co-packaged optics (CPO) prototyping. Supports high-density configurations with aspect ratios from 10:1 up to 20:1, true position center drift ≤ ±1.0μm, and edge chipping size ≤ 1.0μm.
Zero-Defect Quality Assurance via Full Traceability Metrology
Mason do not guess performance metrics. Every serialized batch shipped under our seal undergoes rigorous cleanroom verification. Your physical delivery package will inclu
1. 3D Non-Contact Interferometer Surface Profiles: Maps Apex Offset (≤ 50μm) and Ra micro-texture.
2. Multi-Channel OTDR Trace Sheets: Guarantees absolute insertion loss thresholds (SMF OS2 IL ≤ 0.2 dB) across lanes 1–32 [1.13, 1.14].
3. Automated Optical Inspection (AOI) Logs: Verification of TGV geometry, taper angles, and zero micro-cracking windows.
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